Revolution of microelectronics: AT & S opens innovation center in Leoben!

AT&S eröffnet am 3. Juni 2025 in Leoben Europas erstes IC-Substrat-Werk, stärkt Mikroelektronik und schafft 420 Arbeitsplätze.
AT & S opens on June 3, 2025 in Leoben Europe's first IC substrate plant, strengthens microelectronics and creates 420 jobs. (Symbolbild/ANAGAT)

Revolution of microelectronics: AT & S opens innovation center in Leoben!

In a significant step for European microelectronics, AT&S opened the first IC substrate plant and a competence center in Leoben on June 3, 2025. The new location, known as HTB3, was built with an impressive investment of over 500 million euros and is intended to play a central role in the research and development of high -performance microchips. During the opening ceremony, AT & S-CEO Michael Mertin emphasized the need for a brave and innovative strategy for microelectronics in Europe. He said: "We have to master elementary technologies such as microelectronics in order to be successful on the global market".

The new work is more than just a production facility; It will also act as an innovation smithy and is the first and only of its kind in Europe. Economic Minister Wolfgang Hattmannsdorfer emphasized the central role of microelectronics for the development of technologies such as artificial intelligence and emphasized that the opening of the HTB3 was a decisive step towards creating an independent microelectronics industry in the EU. A total of around 420 new jobs will be created in the region by the opening.

ic substrates and their meaning

But what are IC substrates? They are indispensable components of modern high -performance microchips and enable the connection between the integrated circuit (IC) and the conductor tracks on the circuit board. As a rule, these substrates are structured in several layers and offer numerous functions such as capturing IC chips, the connection to internal circuits and the derivation of heat. Their complexity and importance increase with the development of new IC types such as chip scale packages (CSP) and Ball Grid Packages (BGP), which are aimed at ever denser circuits.

With the new work,

at & s complements its existing production locations in Malaysia and China to create a diversified supply chain. This is particularly important at a time when the demand for microelectronics is growing steadily. The Federal Government has also set a funding focus in the field of microelectronics in recent years and provides 400 million euros for various projects to strengthen the industry.

A look into the future

The new competence center HTB3 will be a driver for innovations in microelectronics and is in line with the ambitious goals of the European Union to expand their own production capacities and skills in the field of semiconductor technology. The entire microelectronics play a central role in various key technologies that are necessary for digitization, electromobility and autonomous driving. Mertin and Hattmannsdorfer agree: only through joint efforts can Europe exist in the international competitive environment.

With the opening of the HTB3, the course for a future -oriented microelectronics industry in Austria and all over Europe is set. Experts agree that the aspiring innovative strength and the committed investments in these future technologies will benefit not only industry, but also climate protection and resource -saving economy.

In addition to the importance of this investment for the region, HTB3 will serve as a lighthouse project for highly innovative industrial approaches in microelectronics that will further strengthen Europe's competitiveness. The way to the digital future is paved.

ots.at nextpcb.com , bmwk.de

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OrtLeoben, Österreich
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